HP Chang 張惠普

Provided fast and stable AI inspection solution fastable.ai

• Instituted a robust AI for manufacturing clients, resulting in a 0% defect underkill rate.
• Led the creation of an AI platform for AOI systems, from initial prototype to deployment.
• Drove product planning and customer engagement, successfully delivering valuable solutions to penetrate new markets and applications.

Worked on developing Touch&Display driver integration(TDDI) from 0 to 100Mu shipments in 3yrs with exceptional cross-geography teamwork.

• Led 1st TDDI XL display ASIC to MP with A0 silicon for 9 customers.
• Led 1st TDDI Gen2 ASIC to MP, 3 months ahead of original target.
• Constructed TDDI Gen1 for world’s first TDDI single-chip solution.
• Implemented an auto-notify FW build validation of continuous integration(CI). Focused on cloud-based automated regression testing.

Led and supported in 10+ ODM projects from design-in to massproduction, accounting for millions of shipped cameras. And brought up SoCs drivers (CMOS sensor, LCD, Audio Codec…) connecting through common interface (LVDS, I2C, SPI, UART…) and debugging and developing features in image signal processing pipeline&software flow.

In one year, built the smallest 2-axes anti-shake O.I.S system for mobile phone camera in collaboration with Japanese engineering colleagues, and implemented camera module system with H.264 video recording in WinCE platform.